FAQ

Find out more about our product in our FAQ section.

What are the most important highlights?

– High-quality cuts
– Material independency
– Free-form cutting
– No chipping or cracks
– No burr or delamination
– No debris deposition
Which kind of features do you offer?

– No coating required
– Standard tape frame application
– Cleanroom suitability
– Plug & play application
– Incl. SECS/GEM interface
Does it have any adavantages for my production?

– Reduce inspection efforts (AOI)
– Unmatched up-time
– Scribe and dice in one step
– Cut multi-project-wafer
– Full cut, trimming and grooving
– Virtually 100% yield
Is your machine fully automatic?

LidroCUT® is a compact semi-automatic laser machine. The next generation in 2024 will be fully automatic.
Which types of wafers can you handle?

Currently, we can handle wafer up to 8″ diameter and 1mm thickness. On request, 12″ diameters and full automation for OHR are also possible.
How does your process work?

The reliable processing is done by laser ablation in liquids and offers excellent cutting quality, highest precision and maximum yield and output.
What kind of materials are you processing?

The machine is suitable for any materials: metals, ceramics, semiconductor materials, like Si, SiC, GaAs, glasses, etc. . Also, multilayer material systems, like copper on silicon, low-k-materials, ceramics, etc.

If your question is not clearly answered, feel free to reach out to our technical team.