LidroCUT® - Laser Dicing in Liquids

The latest innovation in wafer dicing technology – ready to be cutting edge?

Our innovation combines opposites

Excellent quality and highest precision in cutting microchips and devices (wafer dicing) are the main features of Lidrotec’s innovative laser technology. With it, we set new standards for a variety of industries: semiconductor, energy, medicine, electronics and material science.

While the processing is done by a laser, we use controlled fluids, which perform several crucial functions at the same time: efficient cooling of the workpiece surface (» no heat input – no microcracks), binding and rinsing of nano- and microparticles (» no debris on the surface), and optimization of laser ablation due to the physicochemical interactions between laser beam, liquid and workpiece.

Specialised on silicon carbide

Redefining sharpness & speed in wafer technology!

OUR UNIQUE TECHNOLOGY FEATURES


Quality

Burr-free and sharp cutting edges lead to less scrap and increase production yield


Precision

Minimal cutting widths and a high aspect ratio increase the number of chips on each wafer


Freeform cutting

We enable innovative chip designs – thinking beyond traditional, conventional boundaries


Cleanliness

The surface of the chips is clean and requires no additional post-treatment steps


Material independency

All materials can be cut, eliminating the need for complex production steps like step-cuts


Flexibility

Full cuts, structuring, grooving, and functionalization – all possibilities in one machine

LidroCUT® – by Lidrotec

Dive in and discover more information in our FAQ.


Semiconductor production mastery

Maximize yield, uptime, and efficiency with our advanced machine. Streamline processes by scribing and dicing in a single step, eliminating the need for coating. Elevate your semiconductor manufacturing with innovation and precision.


Precision at every step

Unlock the full potential of semiconductor manufacturing with our machine’s versatile capabilities. From full cut, trim, and groove to seamless tape frame application, our technology ensures precision. Ideal for cleanroom environments, it sets the standard for high-quality production.


Streamlined Efficiency & enhanced control

Experience convenience with our plug & play application. The integrated SECS/GEM interface ensures seamless communication and streamlined operations. Elevate your semiconductor manufacturing effortlessly with user-friendly features and enhanced control.


Cutting-edge innovation

Explore unparalleled advantages in semiconductor production with our cutting-edge machine. Simplify processes, eliminate coating needs, and cut multi-project wafers to reduce inspection efforts. Elevate your manufacturing with our innovative solution.


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Once per quarter, you will receive our newsletter with all updates, news and stories.

The latest innovation in wafer dicing technology - ready to be cutting edge?

Would you like to learn more about our cutting-edge laser technology and have a thorough understanding of the various ways that this technology is changing the world?
If so, we cordially encourage you to download our brochure, which is made to expand your knowledge and acquaint you with the various uses and possibilities of our technology.

Semiconductor equipment
– Made in Germany


Our team & open positions

Get in touch with the founders or see all job offers and directly become a part of the team.


Contact us

We’d be pleased to provide detailed insights into our technology, discuss feasibility studies and contract manufacturing options, and offer guidance on all aspects of wafer dicing in liquids.

CONTACT

    ADDRESS

    Lidrotec GmbH
    Lothringer Allee 2
    44805 Bochum
    Germany

    M: info@lidrotec.com
    P: +49 234 904 13 770

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