Semiconductor production mastery
Maximize yield, uptime, and efficiency with our advanced machine. Streamline processes by scribing and dicing in a single step, eliminating the need for coating. Elevate your semiconductor manufacturing with innovation and precision.
Precision at every step
Unlock the full potential of semiconductor manufacturing with our machine’s versatile capabilities. From full cut, trim, and groove to seamless tape frame application, our technology ensures precision. Ideal for cleanroom environments, it sets the standard for high-quality production.
Streamlined Efficiency & enhanced control
Experience convenience with our plug & play application. The integrated SECS/GEM interface ensures seamless communication and streamlined operations. Elevate your semiconductor manufacturing effortlessly with user-friendly features and enhanced control.
Explore unparalleled advantages in semiconductor production with our cutting-edge machine. Simplify processes, eliminate coating needs, and cut multi-project wafers to reduce inspection efforts. Elevate your manufacturing with our innovative solution.