LidroCUT® - Laser Dicing in Liquids

The latest innovation in wafer dicing technology – ready to be cutting edge?

LidroCUT® – by Lidrotec

Our innovation combines opposites

Excellent quality and highest precision in cutting microchips and devices (wafer dicing) are the main features of Lidrotec’s innovative laser technology. With it, we set new standards for a variety of industries: semiconductor, energy, medicine, electronics and material science.

While the processing is done by a laser, we use controlled fluids, which perform several crucial functions at the same time: efficient cooling of the workpiece surface (» no heat input – no microcracks), binding and rinsing of nano- and microparticles (» no debris on the surface), and optimization of laser ablation due to the physicochemical interactions between laser beam, liquid and workpiece.



Burr-free and sharp cutting edges lead to less scrap and increase production yield


Minimal cutting widths and a high aspect ratio increase the number of chips on each wafer

Freeform cutting

We enable new chip designs
– thinking outside the box


The surface of the chips is clean and requires no post-treatment steps

Material independency

Any material and all material systems can be cut, hence no step-cut or other complex production steps are required


Full cuts, structuring, grooving, functionalization – all possibilities in one machine

LidroCUT® – Quick facts

A short summary of LidroCUT®

  • – High-quality cuts
    – Material independency
    – Free-form cutting
    – No chipping or cracks
    – No burr or delamination
    – No debris deposition

  • – No coating required
    – Standard tape frame application
    – Cleanroom suitability
    – Plug & play application
    – Incl. SECS/GEM interface

  • – Reduce inspection efforts (AOI)
    – Unmatched up-time
    – Scribe and dice in one step
    – Cut multi-project-wafer
    – Full cut, trimming and grooving
    – Virtually 100% yield

  • You can find more details on our FAQ page. Just click here to get there.

The latest innovation in wafer dicing technology - ready to be cutting edge?

Would you like to learn more about our cutting-edge laser technology and have a thorough understanding of the various ways that this technology is changing the world?
If so, we cordially encourage you to download our brochure, which is made to expand your knowledge and acquaint you with the various uses and possibilities of our technology.

Semiconductor equipment
– Made in Germany

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Our team & open positions

Get in touch with the founders or see all job offers and directly become a part of the team.

Contact us

We’d be pleased to provide detailed insights into our technology, discuss feasibility studies and contract manufacturing options, and offer guidance on all aspects of wafer dicing in liquids.



    Lidrotec GmbH
    Lothringer Allee 2
    44805 Bochum

    P: +49 234 904 13 770